OFFERS AND EMS SERVICES
- SMT automated assembly
- SMT an THT mixed assembly
- Reflow soldering
- Inspection and functional test
- Supply of PCBs
- Supply of components, ICs
- Supply high quality SMT Stencils (laser cut)
- Material management
- Professional support at electronic devices manufacturing for our business partners
NEWS
MGSM modules - industrial modems
MGSM modules - standard mobiles
Alarm control panels
Power supplies, Radio remote controllers
Accessories
Monitoring station
Software
Download
ARCHIVES
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The Ropam Elektronik offers complex customer service within the scope of contract electronic manufacturing (EMS services). We specialize in electronic assembly of the prototypes and small and medium-sized lots of the highly specialized electronic systems. Our many years experience, modern technologies and renowned production equipment enable us to act quickly to serve your needs.
EVERTIQ NEWS
CAPACITY
- Highest quality guaranteed by IPC Specialist certificates
- Production process according to IPC standard IPC-A-610D
- Modern and profesional engine park
- EPA secured working areas
- Long experience: electronic design and assembly
- Cooperation with leading Suppliers: ICs, components, ICs and EMS products
- Highest quality guaranteed by IPC Specialist certificates
- Production process according to IPC standard IPC-A-610D
- Modern and profesional engine park
- EPA secured working areas
- Long experience: electronic design and assembly
- Cooperation with leading Suppliers: ICs, components, ICs and EMS products
THE ENGINE PARK
The Pick and Place machine: MP-100 (DIMA):
- Full vision pick and place machine, ESI correct place
- Placement rate of up to 4800 CPH
- Board Size : max 380x500mm, PCB thickness: 0,5mm to 4,5 mm
- Components: CHIP, MELF, SOT, SOIC, TSOP, TNT,
PLCC, QFP, BGA, LCC,uBGA
- Component size: 0201 to QFP208 /max. 42x42mm/
The Pick and Place machine: MP-100 (DIMA):
- Full vision pick and place machine, ESI correct place
- Placement rate of up to 4800 CPH
- Board Size : max 380x500mm, PCB thickness: 0,5mm to 4,5 mm
- Components: CHIP, MELF, SOT, SOIC, TSOP, TNT,
PLCC, QFP, BGA, LCC,uBGA
- Component size: 0201 to QFP208 /max. 42x42mm/
The Reflow Oven: SMT 1.2 TC (SMT Wertheim):
- Dediacate to Lead Free Soldering
- Heating modules: 3 (convection zone 1951 mm)
- Microprocessor control (CAN bus network)
- Patented power nozzle system which guarantees a perfect
temperature distribution.
- Exhaust air filter
The Stencilprinter: DIETER-METZ
- High accuracy, dediacate to FinePitch
- Semi automatic stencil printer
Optical inspection systems:
- Stereo Zoom Microscopes
- Microscopes systems with LCD moniotrs
Projekt współfinansowany z Europejskiego Funduszu Rozwoju Regionalnego w
ramach Małopolskiego Regionalnego Programu Operacyjnego na lata 2007-2013.
